Saraswati, S., & Arora, D. (2024). Polymer Dielectrics for Electronic Packaging: Curing Dynamics of an Epoxy Resin Blend. 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) . https://doi.org/10.1109/EDTM58488.2024.10512252
Conference Presentations
Saraswati, S., Arora, D. (2022). Structure-Property for Epoxy Blends in Electronic Packaging. Presented at CompFlu '22, organised by the Indian Society of Rheology and IIT Kharagpur in Kolkata, India.
Saraswati, S., Arora, D. (2023) Structure-Property of Epoxy Blends in Electronic Packaging: Impact of Heating Rate. Presented at CompFlu '23, organised by the Indian Society of Rheology and IIT Madras in Chennai, India.
Saraswati, S., Arora, D. (2024) Polymer Dielectrics for Electronic Packaging: Curing Dynamics of an Epoxy Resin Blend. Presented at IEEE EDTM 2024 in Bangalore, India.
Saraswati, S., Arora, D. (2024) Cross-linking Dynamics in an Epoxy Blend: Glass Transition and Implications for Electronic Packaging. Presented at CompFlu '24, organised by the Indian Society of Rheology and IIT Hyderabad in Hyderabad, India.
Kumar, R., Saraswati, S., Arora, D. (2024) A Robust Methodology to Detect Thermal Transitions in Cross-linkable Polymers Utilizing Differential Scanning Calorimetry Data. CompFlu '24, organised by the Indian Society of Rheology and IIT Hyderabad in Hyderabad, India.
Saraswati, S., Arora, D. (2025) Cross-linking Dynamics in an Epoxy Blend: Glass Transition and Implications for Electronic Packaging. Presented at ISPEC 2025 in Gandhinagar, India.
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